UV Curable Dicing Tape For Wafer Cutting

UV Curable Dicing Tape For Wafer Cutting

It Is As Polyolefin Film As Backing, Coated With UV Adhesive, Then Coated With PET Release Liner.

Packaging Details:

Export standard packing for UV Curable Dicing Tape For Wafer Cutting. (If customers have special requirements, we also can make accordingly.)

Note: All data contained in this document base on china standard test method, they are average values, they should not be used for a specific purpose. All statements, technical information, and recommendations contained are base upon tests that we believe are reliable, but we strongly recommend clients should do their own tests and decide whether the product is fit for a particular purpose or the method of application.

These product properties are suggestive and all products can be customized or converted to fit specific application requirements. Please contact us to discuss your unique application needs.

Our Factory Competitive Advantages:

Well Competitive Prices and High Quality Control.
Prompt Delivery.
Earth-friendly Products.
In a Variety of Design.
Small Order Acceptable.
OEM Accepted.

Roll Size: 3″ paper or plastic core;tape width: 2mm -1200mm; standard width: 1200mm, standard length: 50M.

OEM Size: Special length, thickness or combinations can be supplied per customer’s request. Products can be supplied in roll, tape, sheets or shapes per customer’s request. Only you provide the CAD drawing, we can die cut any size for you.

Shelf Life: To obtain best performance, use this product within 12 months from date of delivery and store under normal conditions of 60 ºC to 80ºF (16 ºC to 27ºC) and 40 to 60% R.H. in the original carton.