Tin Plated Copper Conductive Foil Tape for EMI Shielding
Place of Origin:Guangdong, China
Brand Name:Xinst
Model Number:6970CU
Material:Tin+Cu
Feature:Heat-Resistant
Use:Masking
Adhesive:Acrylic
Adhesive Side:Double Sided
Adhesive Type:Pressure Sensitive
Design Printing:No Printing
Color:Copper
Thickness(mm):0.08
Application:Repair for shielding signal cable or FFC
Tin Plated Copper Conductive Foil Tape Product Description
Tin-plated-copper-conductive-foil-tape consists of an embossed deadsoft tin-plated copper foil backing and an aggressive pressure-sensitve acrylic adhesive. The edgs of the embossed pattern pressed into the foil cut through the adhesive layer to establish reliable metal-to-metal contact between the backing and the application substrate.
Features:
• Good electrical conductivity from the base material through the surface of viscose to foil substrate.
• With good shielding effect.
Our Factory Competitive Advantages:
Well Competitive Prices and High Quality Control.
Prompt Delivery.
Earth-friendly Products.
In a Variety of Design.
Small Order Acceptable.
OEM Accepted.
Roll Size: 3″ paper or plastic core;tape width: 2mm -1200mm; standard width: 1200mm, standard length: 50M.
OEM Size: Special length, thickness or combinations can be supplied per customer’s request. Products can be supplied in roll, tape, sheets or shapes per customer’s request. Only you provide the CAD drawing, we can die cut any size for you.
Shelf Life: To obtain best performance, use this product within 12 months from date of delivery and store under normal conditions of 60 ºC to 80ºF (16 ºC to 27ºC) and 40 to 60% R.H. in the original carton.
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Double Tin Plated Copper Conductive Foil Tape Applications:
• Used for high-end electronic equipment, components of the grounding and EMI shielding, the tin on the plating layer has good weld-ability, and high oxidation and corrosion resistance.
Double Tin Plated Copper Conductive Foil Tape Specifications:
Part No. | Color | Backing | Total Thickness (um) | The melting point temperature of tin plating layer | Adhesion (g/25mm) |
6970CU | Sliver | Tin+Cu | 70±5 | >232℃ | 800±100 |