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NITTO REVALPHA No.3195 Thermal Release Tape For Hard Substrate
* Adhesive strength becomes almost “zero” by heating and REVALPHA can be removed without damaging substrates.
* Substrates can be processed by temporarily fixing a REVALPHA’s pressure sensitive adhesive face to the stage.
* Provides a high processing accuracy since substrates are kept in a fixed position.
*Three types (rolls, labelers and sheets) are available.
* Environmentally friendly since no cleaning is required for substrates.
NITTO3195 REVALPHA No.3195 Thermal Release Tape For Hard Substrate
The nitto3195 thermal release tape "REVALPHA" is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off
just by heating. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing
processes.
NITTO REVALPHA No.3195 Thermal Release Tape For Hard Substrate Applications:
* Temporary fixing during dicing electronic components.
* Temporary fixing to prevent misalignment of the substrates.
* For chip transfer.
Die cutting designs can includes holes, shapes, oversized lines (for easy removal) and complimentary products can also be incorporated.
Die cutting tapes enable you to save a significant amount of time when applying the adhesive tape and to save money for cuts through slitting.
Our Factory Competitive Advantages:
Well Competitive Prices and High Quality Control Prompt Delivery Earth-friendly Products In a Variety of Design Small Order Acceptable OEM Accepted
Roll Size: 3″ paper or plastic core;tape width: 2mm -1200mm; standard width: 1200mm,standard length:50M
OEM Size:Special length, thickness or combinations can be supplied per customer’s request.Products can be supplied in roll,tape,sheets or shapes per customer’s request.Only you provide the CAD drawing,we can die cut any size for you.
Shelf Life: To obtain best performance, use this product within 12 months from date of delivery and store under normal conditions of 60 ºC to 80ºF (16 ºC to 27ºC) and 40 to 60% R.H. in the original carton
If the NITTO REVALPHA No.3195 Thermal Release Tape For Hard Substrate to your requirement, please be free to buy the quality products made in China with our professional manufacturers and suppliers in China. We’re equipped with a productive factory at your service.
NITTO REVALPHA No.3195 Thermal Release Tape For Hard Substrate Applications:
* Temporary fixing during dicing electronic components.
* Temporary fixing to prevent misalignment of the substrates.
* For chip transfer.
Die cutting designs can includes holes, shapes, oversized lines (for easy removal) and complimentary products can also be incorporated.
Die cutting tapes enable you to save a significant amount of time when applying the adhesive tape and to save money for cuts through slitting.
| Product Name | NITTO REVALPHA No.3195 Thermal Release Tape For Hard Substrate |
| Adhesive Type | Foaming adhesive |
| Color | white/blue/yellow |
| Temperature Resistance | -20°C -100°C |
| Before foaming | 4.0N/20mm |
| After foaming | 0.02N/20mm |
| Features | * Adhesive strength becomes almost “zero” by heating and REVALPHA can be removed without damaging substrates. * Substrates can be processed by temporarily fixing a REVALPHA’s pressure sensitive adhesive face to the stage. * Provides a high processing accuracy since substrates are kept in a fixed position. *Three types (rolls, labelers and sheets) are available. * Environmentally friendly since no cleaning is required for substrates. |
| Thickness | 0.16mm |
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