Xinst 0701 Copper Foil Tape With Acrylic Adhesive for soldering
Backing Thickness: 18/25/50um
Total Thickness: 0.05/0.06/0.07/0.085mm
Breaking Strength: 100-120N/25mm
Electrical Resistance Through Adhesive: 0.005 ohm
Flame Retardancy: Pass
Min Order Quantity: 1000 Square Meters
Supply Ability: 15000 Square Meters
Port: Shenzhen, China
Payment Terms: T/T, L/C, Paypal, Western Union
Delivery Time: About 10-15 days
Xinst 0701 Copper Foil Tape With Acrylic Adhesive for soldering
Copper Foil Tape for soldering has an 18/25/50um smooth copper (Purity is 99.95%) foil backing with a 35um not conductive acrylic pressure-sensitive adhesive and liner. The unplated copper with conductive adhesive is a common EMI shielding tape for non-corrosive conditions.
Features:
- Dead soft copper foil backing for good shielding effectiveness, soldering and converting (slitting and die cutting).
- Acrylic pressure-sensitive adhesive has good resistance to heat, oxidation, solvents and oils.
- Removable liner on adhesive side makes it easy to handle,protect the adhesive prior to application and die cut complex shapes.
Packaging Details:
Export standard packing for Copper Foil With Acrylic Adhesive Tape. (If customers have special requirements, we also can make accordingly.)
Our Factory Competitive Advantages:
- Well Competitive Prices and High Quality Control
- Prompt Delivery
- Earth-friendly Products
- In a Variety of Design
- Small Order Acceptable
- OEM Accepted
Note: All data contained in this document base on china standard test method, they are average values, they should not be used for a specific purpose. All statements, technical information, and recommendations contained are base upon tests that we believe are reliable, but we strongly recommend clients should do their own tests and decide whether the product is fit for a particular purpose or the method of application.
These product properties are suggestive and all products can be customized or converted to fit specific application requirements. Please contact us to discuss your unique application needs.
- Commonly used for RFI/EMI (radio-frequency interference or electromagnetic interference) shielding and ESD (electrostatic discharge) grounding for components, integrated circuits, connectors, cables, motors, equipment enclosures/cabinets and shielded rooms.
- Conductive circuit or bus bar for low voltage applications.
- Used in jobs requiring high conductivity or shielding effectiveness for a given thickness.
- Best used in non-corrosive environments.
Backing Thickness | 18/25/50um |
Total Thickness (Backing plus Conductive Adhesive) | 0.05/0.06/0.07/0.085mm |
Breaking Strength | 100-120N/25mm |
Electrical Resistance Through Adhesive | 0.005 ohm |
Flame Retardancy | Pass |