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Xinst 6011 Semiconductor Wafer Mounter Cubettatrice Nastro a rilascio termico su un lato

* La forza adesiva diventa quasi "zero" riscaldando e REVALPHA può essere rimosso senza danneggiare i substrati.
* Substrates can be processed by temporarily fixing a REVALPHA’s pressure sensitive adhesive face to the stage.
* Provides a high processing accuracy since substrates are kept in a fixed position.
*Three types (rolls, labelers and sheets) are available.
* Environmentally friendly since no cleaning is required for substrates

Xinst 6011 Semiconductor Wafer Mounter Cubettatrice Nastro a rilascio termico su un lato

Pyrolysis thinning film, called positioning slitting styrofoam in the industry, also known as hot peeling tape/cutting film/mlcc cutting film, etc., before being heated, it is pasted on the surface of the object, which can play a good role in the object. The function of protection and shielding can be easily debonded after the thermal process, so that the processed parts can be easily/easy peeled off without leaving residual glue, which is conducive to automation, saves manpower/material resources, and improves efficiency.

Thermal Release Tape Applications:

Used in delicate and fragile wafer processing; positioning and cutting in the process of MLCC chip capacitors and chip inductors; semiconductor wafer surface processing; electronic and optoelectronic industrial components manufacturing and processing engineering; LCD and TP touch panel glass thinning, grinding and polishing; LED cutting, grinding and polishing; sapphire substrate thinning and polishing process; copper substrate graphene (Graphene) transfer and carbon nanotube transfer applications, which can replace UV blue film.

Size: 150*150 160*160 180*180 200*200mm, etc., special specifications can be cut according to customer needs.

Viscosity: low viscosity 200G; medium viscosity 400G; high viscosity 700G; special viscosity can be customized according to customer needs.

Stripping temperature: 90-100 degrees, the slitting temperature does not exceed 70 degrees; 120-130 degrees, the slitting temperature does not exceed 90 degrees; 140-150 degrees, the slitting temperature does not exceed 120 degrees. Special needs customer demand production.

Foaming peeling time: 10 seconds-3 minutes.

Special reminder; the oven temperature must reach the set temperature before the product can be put in for foaming, so that the effect can be achieved.

I progetti di fustellatura possono includere fori, forme, linee sovradimensionate (per una facile rimozione) e possono anche essere incorporati prodotti complementari.
I nastri fustellatori consentono di risparmiare una notevole quantità di tempo durante l'applicazione del nastro adesivo e di risparmiare denaro per i tagli attraverso il taglio.

 

I nostri vantaggi competitivi di fabbrica:

Prezzi competitivi e controllo di alta qualità Pronta consegna Prodotti ecocompatibili in una varietà di design Piccolo ordine accettabile OEM accettato

Dimensioni rotolo: 3 "anima in carta o plastica; larghezza del nastro: 2 mm -1200 mm; larghezza standard: 1200 mm, lunghezza standard: 50 m

Dimensioni OEM : lunghezza, spessore o combinazioni speciali possono essere forniti su richiesta del cliente.I prodotti possono essere forniti in rotolo, nastro, fogli o forme su richiesta del cliente.Solo tu fornisci il disegno CAD, possiamo tagliare qualsiasi dimensione per te.

Durata a per ottenere le migliori prestazioni, utilizzare questo prodotto entro 12 mesi dalla data di consegna e conservarlo in condizioni normali da 60 ºC a 80ºF (da 16 ºC a 27ºC) e dal 40 al 60% di umidità relativa nella confezione originale

Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape

If the Xinst 6011 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape to your requirement, please be free to buy the quality products made in China with our professional manufacturers and suppliers in China. We’re equipped with a productive factory at your service.

Applicazioni:

Used in delicate and fragile wafer processing; positioning and cutting in the process of MLCC chip capacitors and chip inductors; semiconductor wafer surface processing; electronic and optoelectronic industrial components manufacturing and processing engineering; LCD and TP touch panel glass thinning, grinding and polishing; LED cutting, grinding and polishing; sapphire substrate thinning and polishing process; copper substrate graphene (Graphene) transfer and carbon nanotube transfer applications, which can replace UV blue film.

Size: 150*150 160*160 180*180 200*200mm, etc., special specifications can be cut according to customer needs. Viscosity: low viscosity 200G; medium viscosity 400G; high viscosity 700G; special viscosity can be customized according to customer needs. Stripping temperature: 90-100 degrees, the slitting temperature does not exceed 70 degrees; 120-130 degrees, the slitting temperature does not exceed 90 degrees; 140-150 degrees, the slitting temperature does not exceed 120 degrees. Special needs customer demand production. Foaming peeling time: 10 seconds-3 minutes. Special reminder; the oven temperature must reach the set temperature before the product can be put in for foaming, so that the effect can be achieved.Die cutting designs can includes holes, shapes, oversized lines (for easy removal) and complimentary products can also be incorporated.
I nastri fustellatori consentono di risparmiare una notevole quantità di tempo durante l'applicazione del nastro adesivo e di risparmiare denaro per i tagli attraverso il taglio.
nome del prodotto
Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape
Tipo adesivo
Foaming adhesive
Colore
white/blue/yellow
Resistenza alla temperatura
-20°C -130°C
Before foaming
4.0N/20mm
After foaming
0.02N/20mm
Caratteristiche

* La forza adesiva diventa quasi "zero" riscaldando e REVALPHA può essere rimosso senza danneggiare i substrati.

* I substrati possono essere lavorati fissando temporaneamente la superficie adesiva sensibile alla pressione di REVALPHA sul piano.
* Fornisce un'elevata precisione di elaborazione poiché i substrati sono tenuti in una posizione fissa.
* Sono disponibili tre tipi (rotoli, etichettatrici e fogli).
* Rispettoso dell'ambiente poiché non è necessaria la pulizia dei supporti.
Spessore
0.15mm

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