Guarnizione in schiuma conduttiva di schermatura EMI fustellante
Model Number:OEM
adesivo per
adesivo su un
stampa
Material:conduction foam
Caratteristica: resistente al calore
Uso: MASCHERATURA
: personalizzata
Thickness:0.1-0.3
EMI Shielding Conductive Foam Gasket Introduce
Shielding Conductive foam gasket is wrapped on the sponge conductive cloth, after a series of processing, has the good electrical conductivity, surface can be easily fixed in need shielding device with adhesive tape. Have different section shape, installation method, level of UL and shielding effectiveness of shielding materials to choose from.
Caratteristiche:
Four sides are conductive, wrap with conductive cloth, core black foam doesn't conduct, just stuff. One side is coating with conductive glue.
Surface impedance<= 0.08ohm, with excellent protection performance the same as metal. The core material using PU foam can reduce surface pressure, with excellent resilience. The gasket with smooth and soft conductive fiber so can be adapted to a surface. This gasket is difficult to be fired, you can use it safely.
Widely using for EMI Shielding of OA machine, laptop, pc or computer peripherals.
Dettagli sul confezionamento:
Export standard packing for Die Cutting EMI Shielding Conductive Foam Gasket. (If customers have special requirements, we also can make accordingly.)
I nostri vantaggi competitivi di fabbrica:
- Prezzi competitivi e controllo di alta qualità
- Pronta consegna
- Prodotti ecocompatibili
- In una varietà di design
- Piccolo ordine accettabile
- OEM accettato
Nota: tutti i dati contenuti in questo documento si basano sul metodo di prova standard cinese, sono valori medi, non devono essere utilizzati per uno scopo specifico. Tutte le dichiarazioni, le informazioni tecniche e le raccomandazioni contenute si basano su test che riteniamo affidabili, ma consigliamo vivamente ai clienti di eseguire i propri test e decidere se il prodotto è adatto a uno scopo particolare o al metodo di applicazione.
Queste proprietà del prodotto sono suggestive e tutti i prodotti possono essere personalizzati o convertiti per soddisfare requisiti applicativi specifici. Vi preghiamo di contattarci per discutere le vostre esigenze specifiche dell'applicazione.
Application Ideas:
- Electrical industry EMI shielding.
- DIY for phone, tablet, pad, latptop.
Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure and moderate heat, from 100°F (38°C) to 130°F (54°C), will assist the adhesive in developing intimate contact with the bonding surface.
To obtain optimum adhesion, the bonding surfaces must be clean, dry and well unified. Some typical surface cleaning solvents are isopropyl alcohol or heptane.
Ideal tape application temperature range is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low-temperature holding is generally satisfactory.
Heatsink Material | Silicone |
Colore | Blue |
Silicone pad Size | 10mm×10mm×1mm |
Compatible CPU | CPU |
Applicazione | Processor |
Flame retardancy | 94-V0 |
Temp. | -40C ~ 220C |
Thermal Conductivity | 1.2W ~ 2.0W |
Hardness | 13C ~ 50C |
Voltage Proof | >4KV |
Package Include | 1pcs 100mm×100mm×1mm pads |