UV tape Introduction：

A UV-viscosity protective film is applied to a surface of a glass substrate as a protection method in the manufacturing process, which includes a carrier and a protective film. The carrier corresponds to a sheet structure made of the shape of a glass substrate, the protective colloid is coated on at least one side of the carrier, and its coverage is between 60% and 99%. The protective colloid is resistant to acid and alkali corrosion. UV glue, the protective colloid together with the carrier is completely covered on one side of the glass substrate. The utility model utilizes the protective colloid and / or the light-transmitting film to prevent acid and alkali corrosion, and the protective colloid will harden after being irradiated with ultraviolet light to achieve the effect of reducing viscosity, so that the protective colloid can be easily separated from the glass substrate In order to prevent the glass substrate from being damaged during or after the processing.

UV film Features：

UV film is a special formula coating on the surface of PO, PET film substrate, so as to have strong adhesion before UV light, after UV irradiation, the viscosity is greatly weakened, easy to peel off. . It is suitable for wafer wafer cutting, polishing, glass cutting, PCB cutting, surface protection, etc. in the semiconductor industry, and can avoid residue and poor peeling after UV debonding.

Wafer UV Dicing Tape Specifications：

Color: Transparent
Thickness; 0.075 / 0.1 / 0.125 / 0.17mm
Base material: PO, PET
Short-term temperature resistance: 120 ℃
Long-term temperature resistance: 80 ℃

Wafer UV Dicing Tape Application：

It is suitable for wafer wafer cutting, polishing, glass cutting, PCB cutting, surface protection, etc. in the semiconductor industry. It can avoid the residue and peeling defects after UV debonding.