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Stanzen EMI Shielding Conductive Foam Gasket

Modellnummer: OEM
Klebstoff: Acryl
Klebstofftyp: druckempfindlich
Design Printing:No printing
Material:conduction foam
Merkmal: Hitzebeständig
Use:MASKING
GRÖSSE:Maßgeschneidert
Thickness:0.1-0.3

EMI Shielding Conductive Foam Gasket Introduce

 

Shielding Conductive foam gasket is wrapped on the sponge conductive cloth, after a series of processing, has the good electrical conductivity, surface can be easily fixed in need shielding device with adhesive tape. Have different section shape, installation method, level of UL and shielding effectiveness of shielding materials to choose from.

 

Eigenschaften:

Four sides are conductive, wrap with conductive cloth, core black foam doesn't conduct, just stuff. One side is coating with conductive glue.

Surface impedance<= 0.08ohm, with excellent protection performance the same as metal. The core material using PU foam can reduce surface pressure, with excellent resilience. The gasket with smooth and soft conductive fiber so can be adapted to a surface. This gasket is difficult to be fired, you can use it safely.

Widely using for EMI Shielding of OA machine, laptop, pc or computer peripherals.

Packaging Details:

Export standard packing for Die Cutting EMI Shielding Conductive Foam Gasket. (If customers have special requirements, we also can make accordingly.)

Unsere Wettbewerbsvorteile im Werk:

  • Well Competitive Prices and High Quality Control
  • Prompt Delivery
  • Earth-friendly Products
  • In a Variety of Design
  • Small Order Acceptable
  • OEM Accepted

Hinweis: Alle in diesem Dokument enthaltenen Daten basieren auf der China-Standardtestmethode. Es handelt sich um Durchschnittswerte. Sie sollten nicht für einen bestimmten Zweck verwendet werden. Alle enthaltenen Aussagen, technischen Informationen und Empfehlungen basieren auf Tests, die wir für zuverlässig halten. Wir empfehlen jedoch dringend, dass Kunden ihre eigenen Tests durchführen und entscheiden, ob das Produkt für einen bestimmten Zweck oder die Anwendungsmethode geeignet ist.

Diese Produkteigenschaften sind naheliegend und alle Produkte können an spezifische Anwendungsanforderungen angepasst oder konvertiert werden. Bitte kontaktieren Sie uns, um Ihre speziellen Anwendungsanforderungen zu besprechen.

Application Ideas:

  • Electrical industry EMI shielding.
  • DIY for phone, tablet, pad, latptop.

Bond strength is dependent upon the amount of adhesive-to-surface contact developed. Firm application pressure and moderate heat, from 100°F (38°C) to 130°F (54°C), will assist the adhesive in developing intimate contact with the bonding surface.

To obtain optimum adhesion, the bonding surfaces must be clean, dry and well unified. Some typical surface cleaning solvents are isopropyl alcohol or heptane.

Ideal tape application temperature range is 70°F to 100°F (21°C to 38°C). Initial tape application to surfaces at temperatures below 50°F (10°C) is not recommended because the adhesive becomes too firm to adhere readily. However, once properly applied, low-temperature holding is generally satisfactory.

Heatsink Material Silicone
Farbe Blau
Silicone pad Size 10mm×10mm×1mm
Compatible CPU CPU
Anwendung Processor
Flame retardancy 94-V0
Temp. -40C ~ 220C
Thermal Conductivity 1.2W ~ 2.0W
Hardness 13C ~ 50C
Voltage Proof >4KV
Package Include 1pcs 100mm×100mm×1mm pads

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