xinst UV-1608 PO Film Wafer UV Dicing Tape Substrat UV Dicing Tape

xinst UV-1608 PO Film Wafer UV Dicing Tape Substrat UV Dicing Tape

Wafer UV Dicing Tape is an ultra-strong adhesion UV tape, specially designed for deep-cutting process of LED modules, QFN chips, camera modules, etc. It sustains a strong adhesion during dicing and can turn to very low adhesion after UV exposure, then easily peeled off.

Features:

•The PO/PET film was single coated with special adhesive which has high adhesion. With this tape, the wafer or glass would not
fall off or fly off during grinding and dicing.
• Not any residue on the surface of wafer or glass which is good for processing.
• High adhesion before UV.Once UV-light is exposed on, the adhesion is reduced and it can be removed easily

Unsere Wettbewerbsvorteile im Werk:

Well Competitive Prices and High Quality Control

Prompt Delivery

Earth-friendly Products

In a Variety of Design

Small Order Acceptable

OEM Accepted

Rollengröße: 3″ paper or plastic core;tape width: 2mm -1200mm; standard width: 1200mm,standard length:50M

OEM Größe:Special length, thickness or combinations can be supplied per customer’s request.Products can be supplied in roll,
tape,sheets or shapes per customer’s request.Only you provide the CAD drawing,we can die cut any size for you.

Haltbarkeit:Um die beste Leistung zu erzielen, verwenden Sie dieses Produkt innerhalb von 12 Monaten ab Lieferdatum und lagern Sie es unter normalen Bedingungen von 60 °C bis 80 °F (16 °C bis 27 °C) und 40 bis 60 % relativer Luftfeuchtigkeit im Originalkarton.

If the xinst UV-1608 PO film Wafer Dicing Tape substrate to your requirement, please be free to buy the quality products made in China with our professional manufacturers and suppliers in China. We’re equipped with a productive factory at your service.