ፒአይ ቁሳቁሶች ፖሊማሚድ ፊልም with leading performance in the world, and is called "gold film" in the industry. my country is one of the first countries to develop PI films. Today, PI films have a wide range of applications, including flexible displays, FPC, 5G mobile phones, semiconductor packaging, etc. In recent years, domestic FCCL companies (including foreign-invested companies in the mainland) have continuously increased their demand for electronic-grade PI films, which has also prompted new application areas.

ተጣጣፊ ማሳያ-ተጣጣፊ ንጣፍ ፣ የሽፋን ቁሳቁስ እና የ COF ማትሪያ l

ተጣጣፊ ንጣፍ

ኦሌድ ኤል.ሲ.ሲን በሚተካበት ጊዜ ፣ ​​ወደ ጠመዝማዛ → ሊታጠፍ በሚችል አቅጣጫ ሊንቀሳቀስ ይችላል ፡፡ ተለዋዋጭ ብርሃንን ለማምጣት ኦርጋኒክ ብርሃን-አመንጪ ቁሳቁሶች እና ፊልሞች ለ OLED ቁልፍ ነጥቦች ናቸው ፡፡ ፖሊሜሚድ እጅግ በጣም ጥሩ በሆነ የሙቀት ሙቀት መቋቋም ፣ በሜካኒካዊ ባህሪዎች እና በኬሚካዊ መረጋጋት አሚኒ ፒአይ ንጣፍ ለአሁኑ ተለዋዋጭ ተለዋዋጭ ንጥረ ነገሮች ምርጥ ምርጫ ነው ፡፡

የኦ.ዲ.ዲ የማምረት አቅም ቀጣይነት ባለው ዕድገት ተጠቃሚ በመሆን ፣ የፒ.አይ. substrate ቁሳቁሶች ጠንካራ የገቢያ ፍላጎት አላቸው ፣ እና ለወደፊቱ አሁንም ለእድገቱ ብዙ ቦታ አለ ፡፡ በአሁኑ ጊዜ በቻይና ውስጥ ተለዋዋጭ በሆኑ የታተሙ የወረዳ ንጣፎች ውስጥ ጥቅም ላይ ከሚውሉት ከፍተኛ-ደረጃ ፒአይ ፊልሞች ውስጥ ወደ 85% የሚሆኑት ከውጭ በሚመጡ ምርቶች ላይ መተማመን አለባቸው እና ከውጭ የሚገቡ ምርቶችን ለመተካት ሰፊ ገበያ አለ ፡፡

የሽፋን ቁሳቁስ

ተጣጣፊ ማሳያውን ሙሉ በሙሉ ለመገንዘብ የማሳያው ሽፋን አካል በተደጋጋሚ መታጠፍ ፣ ግልጽ ፣ እጅግ በጣም ቀጭን እና በበቂ ሁኔታ ግትር የመሆን ባህሪዎች ሊኖረው ይገባል ፡፡ የሽፋሽ ማያ ገጾች ለሽፋን ቁሳቁሶች ከፍ ያሉ መስፈርቶች አሏቸው ፣ ይህም የእሱን ተለዋዋጭነት ፣ የብርሃን ማስተላለፍን እና ጥሩ ገጽን ፀረ-ጭረት አፈፃፀም ማሟላት ያስፈልጋል።

የአሁኑ የማጠፊያ ማያ ገጽ ሽፋን ቁሳቁሶች ሲፒአይ ፣ ፒአይ ፣ ፒሲ ፣ አክሬሊክስ እና ፒኢት ይገኙበታል ፡፡ ከነሱ መካከል ፣ የ “CPI” ሽፋን በጣም የሚቻል ነው። ከተራ ቀላል ቢጫ ቢጫ የፒአይ ሽፋን ቁሳቁስ ጋር ሲነፃፀር ቀለም እና ግልጽነት ያለው የ CPI ሽፋን ከፍ ያለ የብርሃን ማስተላለፊያ አለው ፡፡ ከማጠፊያ ማያ ሞባይል ስልኮች ልማት ተጠቃሚ በመሆን የሲፒአይ ሽፋን ቁሳቁሶች ፈጣን የልማት ጊዜን ይፈጥራሉ ፡፡

የ COF ቁሳቁስ

The COF scheme mainly uses polyimide (PI film) mixture materials, with a thickness of only 50-100um, and line width and line spacing below 20um. COF packaging is produced using automated roll-to-roll equipment, which is continuously heated to 400 degrees Celsius during the production process. Since the COF roll-to-roll production process requires heating, and the thermal expansion coefficient of PI film is 16um/m/C, compared to the chip's 2.49um/m/C, the thermal stability is poor, so equipment accuracy and process requirements are required Very high.

FPC: ንዑስ እና ሽፋን ቁሳቁስ

የ FPC አጠቃቀም በአጠቃላይ ተጣጣፊ የመዳብ ፎይል ንጣፍ (ኤፍ.ሲ.ሲ.ኤል) ፣ የሽፋን ፊልም (Coverlayer) ፣ የማጠናከሪያ ሰሌዳ እና ፀረ-የማይንቀሳቀስ ሽፋን እና ሌሎች ቁሳቁሶች እንዲሰሩ ለማድረግ ከመዳብ ፎይል እና ከፒአይ ፊልም ቁሳቁሶች የተሠራ ነው ፡፡

The thickness of PI film can be divided into 0.5 mil, 1 mil, 2 mil, 3 mil and thick film (even products above 10 mil). Advanced or high-end soft boards need to be thinner (0.3 mil) and have more stable dimensional stability. PI film. The general cover film mainly uses PI film with a thickness of 0.5 mil, while the thicker PI film is mainly used for reinforcing plates and other purposes.

In recent years, the increasing demand for applications such as smart phones, tablet computers, liquid crystal displays, and LED backlight modules has driven the demand for PI films. As the proportion of mid-to-high-end mobile phone market shipments has increased year by year, coupled with the surge in demand for smartphones in emerging countries and regions such as Southeast Asia, FPC demand is expected to maintain considerable growth in the next 3-5 years

Semiconductor packaging

Modern electronic packaging technology requires a combination of interconnection technology, power, cooling technology, and device passivation protection technology to ensure that the device has the best performance and reliability.

Polyimide meets the requirements of high purity, high heat resistance, high mechanical properties, high insulation properties, high frequency stability, low dielectric constant and dielectric loss, low moisture absorption, and low internal stress to a large extent. Requirements, low thermal expansion coefficient and low molding process temperature requirements have become the core materials of advanced packaging.