+86 137 6041 5417 እ.ኤ.አ. sales@szxinst.com
search button
ምድቦች
በትእዛዝ ይደውሉ +86 137 6041 5417 እ.ኤ.አ.

xinst UV-1608 PO ፊልም Wafer UV Dising Tepe substrate UV Dising ቴፕ

•The PO/PET film was single coated with special adhesive which has high adhesion. With this tape, the wafer or glass would not
fall off or fly off during grinding and dicing.
• Not any residue on the surface of wafer or glass which is good for processing.
• High adhesion before UV.Once UV-light is exposed on, the adhesion is reduced and it can be removed easily

xinst UV-1608 PO ፊልም Wafer UV Dising Tepe substrate UV Dising ቴፕ

ዋፋር ዩቪ ዳይቪንግ ቴፕ እጅግ በጣም ጠንካራ የማጣበቅ UV ቴፕ ነው ፣ በተለይም ለኤልዲ ሞጁሎች ፣ ለ QFN ቺፕስ ፣ ለካሜራ ሞጁሎች ፣ ወዘተ ጥልቅ-የመቁረጥ ሂደት የተቀየሰ ነው ፡፡ ከዚያ በቀላሉ ተላጠ ፡፡

ዋና መለያ ጸባያት:

•The PO/PET film was single coated with special adhesive which has high adhesion. With this tape, the wafer or glass would not
fall off or fly off during grinding and dicing.
• Not any residue on the surface of wafer or glass which is good for processing.
• High adhesion before UV.Once UV-light is exposed on, the adhesion is reduced and it can be removed easily

የእኛ ፋብሪካ ተወዳዳሪ ጥቅሞች

ደህና ውድድር ዋጋዎች እና ከፍተኛ ጥራት ቁጥጥር

ፈጣን አቅርቦት

ለምድር ተስማሚ ምርቶች

በልዩ ልዩ ዲዛይን ውስጥ

አነስተኛ ትዕዛዝ ተቀባይነት አለው

የኦሪጂናል ዕቃ እቃ ተቀባይነት አግኝቷል

የጥቅልል መጠን: 3 ″ ወረቀት ወይም የፕላስቲክ እምብርት ፣ የቴፕ ስፋት 2 ሚሜ -1200 ሚሜ; መደበኛ ስፋት 1200 ሚሜ ፣ መደበኛ ርዝመት 50 ሜ

የኦሪጂናል ዕቃ መጠን: ልዩ ርዝመት ፣ ውፍረት ወይም ውህዶች በደንበኞች ጥያቄ ሊቀርቡ ይችላሉ ፡
፣ በቴፕ ፣ በሰሌዳዎች ወይም ቅርጾች ሊቀርቡ ይችላሉ ፡፡የ CAD ስዕል ብቻ ካቀረቡ እኛ ለእርስዎ ማንኛውንም መጠን ቆርጠን ልንሞት እንችላለ

የመደርደሪያ ሕይወት- የተሻለ አፈፃፀም ለማግኘት ይህንን ምርት ከተረከቡበት ቀን አንስቶ በ 12 ወራቶች ውስጥ ይጠቀሙ እና በተለመደው ሁኔታ ከ 60 ºC እስከ 80ºF (16 ºC እስከ 27ºC) እና ከዋናው ካርቶን ውስጥ ከ 40 እስከ 60% RH ያከማቹ ፡

 

High temperature 3m 471 tape pvc floor marking tape paint masking tape

If the xinst UV-1608 PO film Wafer Dicing Tape substrate to your requirement, please be free to buy the quality products made in China with our professional manufacturers and suppliers in China. We’re equipped with a productive factory at your service.

መተግበሪያዎች:

* This is for package saw like QFN or BGA.
* Mainly used for the package dicing of all kinds of IC wafers.
Product Name
xinst-UV1608 PO film Wafer UV Dicing Tape substrate UV Dicing Tape
Adhesive Type
silicone
Color
blue/transparent
የፊልም መሠረት
PO film
ልጣጭ ኃይል
(ከ UV በፊት)
800 ግ / 25 ሚሜ
ልጣጭ ኃይል
(ከ UV በኋላ)
10 ግ / 25 ሚሜ
ባህሪያት
•The PO/PET film was single coated with special adhesive which has high adhesion. With this tape, the wafer or glass would not
fall off or fly off during grinding and dicing.
• Not any residue on the surface of wafer or glass which is good for processing.
• High adhesion before UV.Once UV-light is exposed on, the adhesion is reduced and it can be removed easily
Thickness
0.05mm 0.08mm 0.15mm 0.20mm

ለእኛ ኢሜይል ይላኩ

    email እውቂያ
    go top