Toepassingsbeginsel van Silicone Pad

Warmtegeleidende silikoonkussingis 'n nuwe produk wat in die mark ontwikkel is van kleefmiddel vir hitte-afvoer. Dit word hoofsaaklik van silikoon gemaak om die kontak-termiese weerstand wat tussen die oppervlak van die hittebron en die kontakoppervlak van die koelplaat gegenereer word, te verminder. Dit is spesiaal ontwerp vir die gebruik van gapings om hitte oor te dra om die hitte-oordrag tussen die hitte-genererende dele en die hitte-ontledende dele te voltooi. Dit is 'n uitstekende vulmiddel met termiese geleiding. Die toepassingsveld van termiese geleidende silikoonkussings is ook baie uitgebreid. Solank dit 'n masjien is, sal dit hitte opwek wanneer dit gerem word. Hierdie termiese geleidende silikoonkussing is meestal ontwikkel vir presisie-masjinerie. In die vordering van wetenskap en tegnologie kan tradisionele kleefmiddels vir hitteverspreiding nie meer aan die huidige vereistes vir hitteverspreiding vir presisie-instrumente voldoen nie.

The main purpose of selecting thermally conductive silicone pads is to reduce the contact thermal resistance generated between the surface of the heat source and the contact surface of the heat sink. Thermally conductive silicone pads can also fill the gaps in the contact surface very well, pushing air out of the contact surface. Air is a bad conductor of heat, which will seriously hinder the transfer of heat between the contact surfaces; with the addition of thermally conductive silicone pads, the contact surfaces can be better and full contact, and truly face-to-face contact. The reaction at temperature can achieve the smallest possible temperature difference. The thermal conductivity of the thermally conductive silicone pad is relative. Although it has better thermal conductivity in flexible materials, it is generally in the range of 0.6-1.5W / (m · K). The performance may be higher, but none exceed 2W / (m · K).

In fact, the thermal conductive silicone pad is now widely used in the contact between the heating body (power tube, thyristor, electric pile, etc.) and heat dissipation facilities (heat sink, heat sink, shell, etc.) in various electronic products and electrical equipment Surface, play the role of heat transfer medium and moisture, dust, corrosion, shock and other performance. It is suitable for heat dissipation treatment of various microwave devices such as microwave communication, microwave transmission equipment, microwave special power supply, regulated power supply and so on.

Termiese geleidende silikoonkussings wat op 'n tradisionele basis ontwikkel is, het groot vooruitsigte op die mark. Die termiese geleidende silikoonkussing is ook 'n hoë-termiese geleidende verbinding, en dit sal nie stol of gelei nie. Dit kan risiko's soos kortsluitings vermy; sy hoë kleefvermoë en super termiese geleidingsvermoë is tans SVE, GPU en hittebak. Uitstekende oplossing vir termiese geleidingsvermoë tydens kontak